Exhibit Booth Staff Registration Exhibit Booth. Staff registration form for the 73rd ECTC. 1Code2General3Type4PDC5Optional6Review7Payment IDRegistration Code(Required) Please enter your special registration code. 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ECTC uses your email address to communicate essential information regarding current and future ECTC conferences. In order to opt-out please do not click on the above links. If you choose to opt-out it will limit our ability to provide you updates on future ECTC events and news. Exhibitor/Sponsor Statement: Note: IEEE policy requires we offer you the opportunity to opt-out of providing your contact information to ECTC sponsors and exhibitors. ECTC provides this information to select sponsors and exhibitors who provide products and services that are of interest to ECTC registrants. In order to opt-out please do not click on the above links. If you choose to opt-out your information will not be provided to these sponsors and exhibitors. Please review the registration below. Additional options will be available in later steps. Exhibit Booth Attendant Price: Total If you would like to register for Professional Development Courses, please select from one of the options. Click here for more information. Otherwise, please proceed to the next step.Professional Development Courses No Course – $0.00 AM Course – $440.00 PM Course – $440.00 AM and PM Course – $625.00 AM Course(Required)Please select a course…1. High Reliability of Lead-Free Solder Joints — Materials Considerations2. Wafer-Level Chip-Scale Packaging (WCSP) Fundamentals3. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Level and Advanced RF Packages4. Eliminating Failure Mechanisms in Advanced Packages6. Reliability Physics and Failure Mechanisms in Electronics Packaging7. Reliable Integrated Thermal Packaging for Power Electronics8. Introduction to PWB Thermal AnalysesPM Course(Required)Please select a course…9. Additive Flexible Hybrid Electronics – Manufacturing and Reliability10. Fan-Out Packaging and Chiplet Heterogeneous Integration11. Photonic Technologies for Communication, Sensing, and Displays12. Flip Chip Technologies14. Analysis of Fracture and Delamination in Microelectronic Packages15. Polymers in Wafer Level PackagingTotal Note: One meal per day is included with registration. Additional meals each are $75 extra.. Tuesday Additional Meal Price: Wednesday Additional Meal Price: Thursday Additional Meal Price: Friday Additional Meal Price: Tuesday QuantityWednesday QuantityThursday QuantityFriday QuantityArea of Interest(Required)Please select…Applied ReliabilityAssembly and Manufacturing TechnologyEmerging TechnologiesHigh-Speed, Wireless & ComponentsMaterials and ProcessingPackaging TechnologiesProfessional Development CoursesThermal/Mechanical Simulation & CharacteristicsPhotonicsInteractive PresentationsAll Those individuals with a non-U.S. international mailing address may request a visa letter for their attendance at ECTC. If you qualify, and need a visa letter, please select below for the type of letter you would like us to send you. 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